Scholarship Description:
Bond University is pleased to invite to Japanese applicants for 30th Anniversary Scholarship – Japan. This scholarship is available to Japanese students commencing either a bachelor or masters degree at Bond University in 2019 or 2020.
The program is offering a number of part-fee scholarships to high achieving students from Japan, to commemorate the historic milestone in Japanese-Australian friendship.
Host College/University:
Bond University aims to help identify future leaders and realize their full potential by providing access to an exceptional educational experience. It is Australia’s first private, not-for-profit university, offering a personalized academic environment that enables graduates to exceed the outer limits of their potential.
Degree level:
Scholarships are available for the bachelor or masters degree programs.
Field of Study:
Undergraduate, Postgraduate courses are eligible for this scholarship.
Scholarship Award:
- Recipients of the 30th Anniversary – Japan Scholarship are awarded a 50% tuition remission for the duration of their chosen program.
- For students undertaking a package of programs (e.g. English for Academic Purposes followed by a Masters degree), the scholarship will apply to the degree portion of the package only.
- For this scholarship, awards are non-transferable and cannot be redeemed for cash
Nationalities:
Become a citizen of Japan and currently live in Japan.
Eligibility Criteria:
To be considered, applicants must:
- Become a citizen of Japan and currently live in Japan.
- Those studying English as part of the packaged offer at the Bond University College are still eligible to apply.
- Students have received a proposal from Bond University in 2019 or 2020 for either a graduate or masters degree, either to start a package of programs including a bachelor or masters degree.
- Students with packaged offers should start their degree in the package or before the September 2020 semester.
Applying procedure Instructions:
Students must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.
- Applying online to study at Bond University is free and easy. There’s no application fee – no obligation to accept a place if it is offered – it simply gives you another option when it comes to making a decision about your future.
- For postgraduate study, the entry requirements are unique to each individual program. Search for your program of interest to find out the specific entry requirements.
- The 30th Anniversary Scholarship – Japan Application Form can be downloaded at bond.edu.au/scholarship/japan and must be completed in full and returned to international@bond.edu.au by the application closing date.
- Bond will select the successful applicants on a competitive, merit-based process.
Scholarship Official Web Links:
Online Application: ◄–
Scholarship Link: ◄–
Scholarship Deadline:
24 May 2019.
